Photonic ic chip

ABSTRACT

A photonic integrated circuit chip includes vertical grating couplers defined in a first layer. Second insulating layers overlie the vertical grating coupler and an interconnection structure with metal levels is embedded in the second insulating layers. A cavity extends in depth through the second insulating layers all the way to an intermediate level between the couplers and the metal level closest to the couplers. The cavity has lateral dimensions such that the cavity is capable of receiving a block for holding an array of optical fibers intended to be optically coupled to the couplers.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to French Patent Application No.1903064, filed on Mar. 25, 2019, which application is herebyincorporated by reference herein in its entirety.

TECHNICAL FIELD

The present disclosure generally concerns photonic integrated circuits(optical and optoelectronic).

BACKGROUND

During a test step or during the operation of a photonic integratedcircuit, optical signals are supplied to optical inputs of the circuitand corresponding optical signals may be observed or are available atthe level of optical outputs of the circuit. Optical fibers are used totransmit optical signals to the optical inputs of the circuit, forexample, optical signals supplied by one or a plurality of sources ofoptical signals external to the circuit. Optical fibers may also be usedto transmit the optical signals available at the level of the opticaloutputs of the circuit to devices external to the circuit, for example,to devices of analysis of the optical signals.

The optical fibers used to exchange optical signals with a photonicintegrated circuit are generally organized in a fiber array, the fibersof the array being held in place with respect to one another in aholding block. The fibers are arranged in the holding block so that theyall have a first end flush with a same surface of the holding block. Thedistribution of the first ends corresponds to the distribution of aplurality of optical inputs and/or outputs of the circuit. Thus, whenthe first ends of the fibers of the fiber array are arranged oppositesuch a plurality of optical inputs and/or outputs of the circuit, aplurality of optical signals may be exchanged with the circuit.

SUMMARY

The present disclosure generally concerns photonic integrated circuits(optical and optoelectronic). Particular embodiments concern theexchange of optical signals with such circuits during a test step orduring the operation of such circuits.

Embodiments can overcome all or part of the disadvantages of knownphotonic integrated circuits, for example, as concerns the way tooptically couple optical inputs and/or outputs of these circuits tooptical fibers of a fiber array arranged in the holding block.

An embodiment provides a photonic integrated circuit chip comprising aplurality of couplers with a vertical grating coupler, defined in afirst semiconductor or insulating layer topped with an interconnectionstructure comprising a plurality of metal levels embedded in secondinsulating layers. A cavity extends in depth through the secondinsulating layers down to an intermediate level between the couplers andthe metal level closest to the couplers. The cavity has lateraldimensions such that the cavity is capable of receiving a block forholding an array of optical fibers intended to be optically coupled tothe couplers.

According to an embodiment, the lateral dimensions of the cavity areequal to the lateral dimensions of the block plus a tolerance margin.

According to an embodiment, the tolerance margin is in the range from 10μm to 200 μm, preferably from 50 μm to 150 μm, preferably substantiallyequal to 100 μm.

According to an embodiment, the first layer is a semiconductor layer,preferably made of silicon, of semiconductor on insulator type.

According to an embodiment, the first layer is an insulating layer madeof silicon nitride.

According to an embodiment, the first layer rests on a thirdsemiconductor layer, preferably made of silicon, of semiconductor oninsulator type.

According to an embodiment, the bottom of the cavity is opposite theplurality of couplers.

According to an embodiment, the chip further comprises, on an uppersurface of the interconnection structure, a guard ring surrounding thecavity, the guard ring being configured to avoid a flow of glue beyondthe ring when the glue is arranged in the cavity and the block isinserted into the cavity.

According to an embodiment, the guard ring is formed of a plurality ofmetal micropillars regularly distributed along the circumference of theguard ring.

Another embodiment provides an assembly comprising a chip such asdefined hereabove and a block for holding the fiber array inserted intothe cavity.

According to an embodiment, the assembly further comprises glue,preferably epoxy, arranged in the cavity, at least between the bottom ofthe cavity and a surface of the block opposite the bottom of the cavity,the glue holding the block in place in the cavity.

Another embodiment provides a semiconductor wafer comprising a pluralityof chips such as defined hereabove, or a plurality of assemblies such asdefined hereabove.

Another embodiment provides a method implemented from a semiconductorwafer comprising a plurality of photonic circuit chips, each comprisinga plurality of couplers with a vertical grating coupler defined in afirst semiconductor layer or a first insulating layer topped with aninterconnection structure comprising a plurality of metal levelsembedded in second insulating layers, the method comprising the step ofetching, from an upper surface of the interconnection structure, acavity penetrating into the second layers all the way to intermediatelevel between the couplers and the metal level closest to the couplers,the cavity having lateral dimensions such that the cavity is capable ofreceiving a block for holding an array of optical fibers intended to beoptically coupled to the couplers.

According to an embodiment, the method further comprises a step ofsawing the wafer to individualize the chips.

According to an embodiment, the method comprises, for at least one chip,the steps of: arranging glue, preferably epoxy, in the chip cavity;inserting and positioning the block in the cavity to optically coupleends of the fibers to the couplers; and hardening the glue, preferablyby polymerization caused by an exposure to a light radiation, preferablyultraviolet.

The foregoing and other features and advantages will be discussed indetail in the following non-limiting description of specific embodimentsin connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 schematically shows in cross-section view an embodiment of aphotonic integrated circuit of the type to which the describedembodiments apply as an example;

FIG. 2 includes two views in FIG. 2A and 2B, which illustrate a step ofan embodiment of a method;

FIG. 3 includes two views in FIG. 3A and 3B, which illustrate anotherstep of an embodiment of a method;

FIG. 4 schematically shows a cross-section view illustrating the step ofFIG. 2 according to an alternative embodiment; and

FIG. 5 includes two views FIG. 5A and 5B, which illustrate analternative embodiment of the method described in relation with FIGS. 2and 3.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The same elements have been designated with the same reference numeralsin the different drawings. In particular, the structural and/orfunctional elements common to the different embodiments may bedesignated with the same reference numerals and may have identicalstructural, dimensional, and material properties.

For clarity, only those steps and elements which are useful to theunderstanding of the described embodiments have been shown and aredetailed. In particular, the manufacturing, the operation, and thetesting (selection of the optical and electrical input signals andinterpretation of the corresponding output signals) of the photonicintegrated circuits have not been detailed, the described embodimentsbeing compatible with usual photonic integrated circuits.

Throughout the present disclosure, the term (electrically or optically)“connected” is used to designate a direct electrical or opticalconnection between circuit elements, without intermediate element otherthan electrical conductors or optical waveguides, whereas the term(electrically or optically) “coupled” is used to designate an electricalor optical connection between circuit elements that may be direct, ormay be via one or more other elements. Further, unless otherwisespecified, when reference is made to an optical fiber and an opticalinput or output optically coupled together, this means that the fiberand the optical input or output are arranged so that an optical signalcan be transmitted between the fiber and the optical input or output,otherwise than by evanescent coupling or near-field coupling, and thedistance between the optical fiber and the optical input or output thuscoupled may then be greater than one or a plurality of times thewavelength of the optical signal.

In the following description, when reference is made to terms qualifyingabsolute positions, such as terms “front”, “back”, “top”, “bottom”,“left”, “right”, etc., or relative positions, such as terms “above”,“under”, “upper”, “lower”, etc., or to terms qualifying directions, suchas terms “horizontal”, “vertical”, etc., unless otherwise specified, itis referred to the orientation of the drawings.

The terms “about”, “approximately”, “substantially”, and “in the orderof” are used herein to designate a tolerance of plus or minus 10%,preferably of plus or minus 5%, of the value in question.

FIG. 1 schematically shows in the form of blocks an embodiment of aphotonic integrated circuit chip 1000 of the type to which the describedembodiments apply as an example, it being understood that theembodiments which will be described hereafter are not limited to thisspecific example of chip or of photonic integrated circuit.

Chip 1000 comprises a semiconductor layer 10, preferably made ofsilicon, resting on an insulating layer 12 (BOX), preferably made ofsilicon oxide, itself resting on a support 14 such as a siliconsubstrate. Layer 10 is said to be of SOI (“Semiconductor On Insulator”)type or simply a layer of an SOI device.

In this embodiment, various optical and/or optoelectronic components aredefined inside and/or on top of layer 10. In particular, waveguides 16are defined in layer 10, a single waveguide 16 being shown in FIG. 1.Optical inputs and/or outputs 18 of chip 1000 , that is, optical inputsand/or outputs of the photonic integrated circuits that it comprises,are arranged at ends of waveguides 16, a single optical input 18 beingshown in FIG. 1. In the described embodiments, the case where theseoptical inputs and/or outputs are vertical grating couplers (VGC) isconsidered. Couplers 18 are, like waveguides 16, defined in layer 10. Inthe example of FIG. 1, a phase modulator 20 is also defined in layer 10.

Layer 10 is covered with an insulating layer 22. Layer 22 is in contactwith layer 10. Layers 12 and 22 form an optical sheath having a lowerrefraction index than layer 10. The upper level of layer 22 is hereabove the upper level of layer 10 although, as a variation, the upperlevel of layer 22 may be confounded with the upper level of layer 10.

Although this is not illustrated in FIG. 1, electronic components, forexample, transistors, may be defined inside and/or on top of layer 10.

An interconnection structure 24 tops layer 22. Interconnection structure24 comprises portions of metal layer 26 separated by insulating layers,in this example 28A and 28B, and metal vias 30. Metal vias 30 crossinsulating layers 28A, 28B, and possibly a portion of the thickness ofinsulating layer 22 to electrically couple portions of metal layers 26together and/or to components of chip 1000 defined inside and/or on topof layer 10 and/or to contact pads 32 arranged at the level of an uppersurface of interconnection structure 24. Vias 30 and/or portions ofmetal layers 26 which are not electrically coupled or connected to a pad32 and/or to a component of chip 1000 may be provided in interconnectionstructure 24.

Call metal level or metallization level the assembly of the portions ofmetal layers 26 arranged at a same level in interconnection structure24. In the shown example, the chip comprises four successive metallevels M1, M2, M3, and M4, metal level M1 being arranged on the side oflayer 10, or, in other words, being the metal level closest to layer 10.

In the example of FIG. 1, each metal level M1, M2, M3, and M4 isarranged in a layer 28B, preferably made of silicon oxide, the upperlevel of the metal level being flush with the upper surface of layer 28Bwhere it is arranged. Further, in the example of FIG. 1, a layer 28A,preferably made of silicon nitride, rests on top of and preferably incontact with the upper surface of each assembly of a metal level and oflayer 28B having the metal level arranged therein. Such an alternationof layers 28A and 28B results for example from the manufacturing methodimplemented to form interconnection structure 24. The describedembodiments are not limited to this specific example of interconnectionstructure 24.

As shown in FIG. 1, one or a plurality of insulating layers, in thepresent example, insulating layers 34A and 34B, may be arranged orinterposed between the assembly of layers 10 and 22 and interconnectionstructure 24. In this case, vias 30 of interconnection structure 24 maycross insulating layers 34A, 34B to electrically couple componentsformed inside and/or on top of layer 10 to the rest of theinterconnection structure. More particularly, in the example of FIG. 1,a layer 34B, for example made of silicon oxide, is interposed betweenlayer 10 and interconnection structure 24. Preferably, as shown in FIG.1, a layer 34A, preferably made of silicon nitride, rests on top of andin contact with layer 34B, and layer 34B rests on top of and in contactwith another layer 34A, preferably made of silicon nitride.

In this embodiment, a layer 38 is arranged in layer 34B, layer 38 beingpreferably made of silicon nitride in this example where layer 34B ismade of silicon oxide. Layer 34B thus covers layer 38 and is topped withinterconnection structure 24. Waveguides 36 are defined in layer 38, asingle waveguide 36 being shown in FIG. 1. As for waveguides 16,vertical grating couplers 40 are arranged at ends of waveguides 36.Couplers 40 are, like waveguides 36, defined in layer 38. Couplers 40form optical inputs and/or outputs of chip 1000.

The operation of a vertical grating coupler is based on diffractionphenomena. Couplers 18 and 40 of chip 1000 are configured to emit(optical output) or receive (optical input) a light beam (opticalsignal) propagating in a direction substantially orthogonal to theplanes of layers 10 and 38, the planes of layers 10 and 38 being hereparallel to the upper surface of layer 12. As an example, couplers 18and 40 are configured to emit or receive a beam in a direction formingan angle alpha with the normal to the planes of layers 10 and 38, anglealpha being for example in the range from 20 to 5 degrees, for example,in the order of 8 or 13 degrees. As an example, a vertical gratingcoupler occupies a surface area of approximately 20 μm by approximately30 μm when the received or emitted light beam has a diameter in theorder of 10 μm.

Although this is not shown in FIG. 1, chip 1000 comprises at least oneassembly of a plurality of couplers 18 intended to be optically coupledto first respective ends of the optical fibers of a fiber array arrangedin a holding block. Similarly, chip 1000 comprises at least one assemblyof a plurality of couplers 40 intended to be optically coupled to firstrespective ends of the optical fibers of a fiber array arranged in aholding block.

Waveguides 16 and/or 36 and couplers 18 and/or 40 are preferablyconfigured to operate at wavelengths in near infrared, that is,wavelengths in the range from 1 to 2 μm, preferably equal toapproximately 1.3 μm or approximately 1.55 μm, for example, equal to 1.3μm or 1.55 μm.

An embodiment where chip 1000 comprises silicon couplers 18 and siliconnitride couplers 40 has been shown herein. In an alternative embodiment,not illustrated, couplers 18 may be omitted, chip 1000 then onlycomprising couplers 40. In this variation, waveguides 16 may possibly beomitted. Conversely, in another alternative embodiment, couplers 40 maybe omitted, chip 1000 then only comprising couplers 18. In this othervariation, waveguides 36 may possibly be omitted.

Further, chip 1000 may be one of the chips of a plurality of identicalchips 1000 manufactured from a same conductive wafer or, in other words,a semiconductor wafer may comprise a plurality of identical chips 1000.Chip 1000 may also be an individualized chip, that is, one of the chips1000 obtained after a step of sawing of a semiconductor wafer comprisinga plurality of identical chips 1000.

FIG. 2 schematically shows two views (FIG. 2A and FIG. 2B) illustratinga step of an embodiment of a photonic integrated circuit chipmanufacturing method, FIG. 2A and FIG. 2B being respective cross-sectionand top views of a portion of chip 1000 after the implementation of thisstep. More particularly, the portion of chip 10000 shown in FIG. 2Acorresponds to a portion of a cross-section view along the cross-sectionplane AA of FIG. 2B.

In this embodiment, chip 1000 comprises an assembly of a plurality ofcouplers 18, in the present example, six couplers 18, intended to beoptically coupled to first respective ends of the optical fibers of afiber array maintained in place in a holding block.

At the step of FIG. 2, chip 1000 preferably forms part of asemiconductor wafer comprising a plurality of identical chips 1000, thestep described herein being carried out simultaneously for all the chips1000 in the wafer.

At this step, a cavity 200 has been etched from the upper surface ofinterconnection structure 24, that is, from the upper surface ofinsulating layer 28A at the top of structure 24 in the present example.Cavity 200 is etched through insulating layers 28A and 28B ofinterconnection structures 24. The etching of cavity 200 is stopped atan intermediate level between the lower level of the metal level closestto couplers 18, here, metal level M1, and the upper level of layer 10where couplers 18 are defined. In other words, the etching is performedso that the bottom 201 of cavity 200 is arranged at this intermediatelevel. Preferably, the intermediate level is above the upper level oflayer 22 covering layer 10. In the example of FIG. 2, the etching isstopped in layer 34B.

It should be noted that, in FIG. 2B, couplers 18 and adjacent portionsof waveguide 16 have been shown in visible fashion, at the bottom ofcavity 200, although these couplers 18 and these waveguide portions 16are coated with at least one insulating layer, in the present examplelayer 22, lower layer 34A, and a portion of the thickness of layer 34B.Further, in view B, pads 32 have not been shown.

The lateral dimensions of cavity 200 are determined by the dimensions ofthe fiber array holding block. Thus, cavity 200 is capable of receivingthe fiber array holding block. Indeed, the holding block is intended tobe at least partly inserted into cavity 200, so that the first ends ofthe optical fiber array are optically coupled to couplers 18. Moreparticularly, the lateral dimensions of cavity 200 are slightly greaterthan the corresponding lateral dimensions of the fiber array holdingblock. Preferably, the lateral dimensions of the cavity are equal to thecorresponding lateral dimensions of the holding block, plus a tolerancemargin. The tolerance margin is for example in the range from 10 μm to200 μm, preferably from 50 μm to 150 μm, preferably substantially equalto 100 μm. Such a tolerance margin enables to ascertain that the holdingblock can be inserted into the cavity despite possible manufacturingdispersions during the etching. The tolerance margin also enables theorientation of the holding block in the cavity to be modified to alignthe first ends of the fibers of the array and couplers 18, such analignment taking into account a possible angle alpha between thepropagation direction of a light beam between the first end of a fiberof the array and the corresponding coupler 18.

Further, the location of cavity 200 is determined by the location of thecouplers 18 with which the first ends of the fibers of the fiber arrayare intended to be optically coupled. More particularly, the location ofcavity 200 is determined so that, when the fiber holding block of thefiber array is inserted into the cavity, the first ends of the fibers ofthe fiber array are optically coupled to couplers 18, taking intoaccount a possible angle alpha. Preferably, a step of fine alignment ofthe fibers and of couplers 18 is implemented, during which theorientation of the block in cavity 200 and/or the depth at which theblock is inserted into cavity 200 are modified to maximize the opticalcoupling between the first ends of the fibers of the fiber array andcouplers 18.

As an example of dimensions, a block for holding the fibers of a fiberarray comprising six fibers has a width in the order of a fewmillimeters, for example, smaller than 3 mm, for example, in the orderof 2 mm, for a length of a few millimeters also, for example shorterthan 7 mm, for example, in the order of 5 mm.

FIG. 3 schematically shows FIG. 3A and FIG. 3B, which illustrate anotherstep of an embodiment of a method. FIGS. 3A and 3B correspond torespective FIGS. 2A and 2B, after the implementation of this other step.

At this step, chip 1000 is preferably an individualized chip, althoughthis step may be implemented while chip 1000 still forms part of asemiconductor chip comprising a plurality of identical chips 1000.

At this step, glue 300 has been arranged in cavity 200. As an example,glue 300 fills cavity 200 and is flush with the exposed surface ofinterconnection structure 24, glue 300 being also capable of protrudingabove the level of the exposed surface of interconnection structure 24,for example, by approximately 2 μm. Glue 300 is selected so that anoptical signal transmitted between a fiber of the fiber array and acoupler 18 can propagate in the glue. In other words, glue 300 istransparent to the wavelengths of the considered optical signals. As anexample, glue 300 is an epoxy glue, preferably an epoxy glue having itshardening resulting from a polymerization, for example caused byilluminating glue 300 with ultraviolet light.

Further, at this step, a holding block 302, for example, made of glass,where fibers 304 of the fiber array are arranged, has been inserted intocavity 200. In view FIG. 3A, a single fiber 304 is visible. In FIG. 3B,fibers 304 have not been shown, while couplers 18 and portions ofwaveguides 16 have been visibly shown, although they are topped withinsulating layers and with block 302.

More particularly, block 302 is inserted so that surface 306 of block302 having the first ends of fibers 304 flush therewith, that is, thelower surface of block 302 in FIG. 3A, is opposite bottom 201 of cavity200, and thus opposite couplers 18.

Thus, glue 300 extends from surface 306 of block 302 to bottom 201 ofcavity 200. Preferably, the quantity of glue 300 arranged in cavity 200is selected so that, on insertion of block 302 into cavity 200, glue 300creeps up along the lateral surfaces of block 302 and at least partlyfills the space available between the lateral surfaces of block 302 andthe lateral walls of cavity 200. This enables to increase the stabilityor mechanical resistance of the assembly of chip 1000 and of block 302after glue 300 has hardened with respect to the case where glue 300 isonly present between bottom 201 of cavity 200 and surface 306 of block302. In the shown example, glue 300 totally fills the available spaceand overflows on the upper surface of interconnection structure 24.

The orientation of block 302, and possibly the depth at which block 302is inserted into cavity 200, are determined to optimize, that is,maximize, the optical coupling between fibers 304 and couplers 18. Theimplementation of a step of maximization of the optical coupling betweenthe fibers of a fiber array holding block and vertical grating couplersof an integrated circuit chip, or fine alignment step, is within theabilities of those skilled in the art and will not be detailed herein.As an example, this step may be implemented by supplying an opticalsignal to a coupler 18 by means of a fiber 304, and by modifying theorientation of block 302, and possibly the depth at which block 302 isinserted into cavity 200, to maximize an output quantity of the chip,for example, the amplitude of an electric signal depending on thequantity of light received by coupler 18 or also the quantity of lightsupplied by another coupler 18 optically coupled to the coupler 18receiving the light.

Once block 302 is positioned in cavity 200, a step of hardening of glue300 is carried out. For example, glue 300 is hardened by being exposedto a light source, preferably ultraviolet light. According to anotherexample, the glue is hardened by being heated.

Rather than providing cavity 200 to insert block 302 therein, it couldhave been devised to glue block 302 directly to the upper surface ofinterconnection structure 24, possibly after having removed, at least atthe location where block 302 is glued, the last insulating layer ofinterconnection structure 24, here 28A, which forms, in practice, apassivation layer.

However, transmission losses between the first end of a fiber 304 ofblock 302 and a corresponding coupler 18 would have been moresignificant than in the case illustrated in FIG. 3 due to the largernumber of insulating layers 28A and 28B that an optical signal wouldhave crossed between fiber 304 and coupler 18. Such transmission losseswould for example have been in the range from 0.1 to 1 dB.

Further, the glue used to glue block 302 to the upper surface ofinterconnection structure 24 would have spread on the upper surface,farther than when glue 300 is initially arranged in cavity 200 asdescribed in relation with FIG. 3. Further, the local deposition of thisglue at the location where block 302 would have been glued would be moredifficult to implement than in the case described in relation with FIG.3. Thus, taking the example of chip 1000, this would have resulted inpads 32 being arranged farther from block 302 in the case where block302 would have been glued to the upper surface of interconnectionstructure 24 than in the case where this block is at least partlyinserted into cavity 200. In other words, the provision of cavity 200enables to increase the integration density of chip 1000, in particularas concerns electric connection elements formed at the level of theupper surface of interconnection structure 24.

Further, it would have been difficult, or even impossible, to modify theheight of block 302 with respect to couplers 18 to maximize the opticalcoupling between fibers 304 and couplers 18, conversely to what has beendescribed in relation with FIG. 3.

It could also have been devised to provide a cavity above each coupler18 or, in other words, one cavity per coupler 18. This could haveenabled to decrease the transmission losses of an optical signal betweena fiber 304 and a corresponding coupler 18.

However, each cavity would then have had lateral dimensions in the orderof those of the coupler 18 above which it is arranged, for example, awidth and a length (for example measured in a plane parallel to theplane of layer 10) in the order of 50 μm each. In other words, eachcavity above a corresponding coupler 18 would have had much smallerlateral dimensions, for example by at least one factor 5, than those ofcavity 200. The filling of each of these small cavities with glue tofill the space available between the bottom of the cavity and surface306 of block 302 would then be more difficult to implement than in thecase of FIG. 3 where glue 300 fills the space between bottom 201 ofcavity 200 and surface 306 of block 302.

Further, due to the fact that a portion at least of block 302 isinserted into cavity 200, the portion of block 302 protruding from theupper surface of interconnection structure 24 is less high than if block302 would have been directly glued to this upper surface. This decreasesrisks of tearing of block 302 during the manipulation of the assembly ofchip 1000 and of block 302. The mechanical resistance of the assembly ofchip 1000 is even greater when glue 300 fills all or part of the spaceavailable between the lateral walls of cavity 200 and the lateralsurfaces of block 302. Such a mechanical resistance could not beobtained in the case where block 302 would be directly glued to theupper surface of interconnection structure 24, and thus in the casewhere the glue would only be arranged between surface 306 of block 302and the upper surface of interconnection structure 24, and possiblyalong a lower portion of the lateral surfaces of block 302.

It could also have been devised to use a block for holding the fibers ofa fiber array such that, once inserted into cavity 200, the first endsof the fibers of the array are flush with a same lateral surface of theholding block, so that the first ends are directly appended tocorresponding ends of a plurality of waveguides 16 (“butt coupling”),couplers 18 being then omitted.

In this case, the bottom of cavity 200 should have crossed layer 10where waveguides 16 are defined, which would have decreased the quantityor surface area of layer 10 available to form components therein.

Further, a coupling by placing a fiber end directly against an end of awaveguide 16 would have been less efficient than a coupling to a coupler18. Indeed, the dimensions of a waveguide 16 being much smaller thanthat of the core of a fiber 304, the quantity of light transmitted fromthe fiber to the waveguide would then have been less significant thanwith a coupler 18 which enables to collect a greater quantity of light.

Further, the alignment of an end of an optical fiber with an end of awaveguide 16 in the case of a coupling by placing of the end of thefiber directly against the end of waveguide 16 should be performed witha greater accuracy, for example, in the order of 0.1 μm, than theaccuracy with which the alignment of an end of a fiber 304 with acoupler 18 is performed, the alignment accuracy being then for examplein the order of 1 μm.

FIG. 4 schematically shows a cross-section view illustrating the step ofFIG. 2 according to an alternative embodiment.

In this alternative embodiment, chip 1000 comprise an assembly of aplurality of couplers, for example, six couplers 40, a single one ofwhich is shown in FIG. 3, intended to be optically coupled to firstrespective ends of the optical fibers 304 of a fiber array maintained inplace in a holding block 302.

At the step of FIG. 4, chip 1000 preferably forms part of asemiconductor wafer comprising a plurality of identical chips 1000, thestep described herein being then carried out simultaneously for all thechips 1000 of the wafer.

At this step, rather than etching cavity 200 at a location determined bythe location of an assembly of couplers 18, cavity 200 is etched at alocation determined by the location of the couplers 40 to which thefirst respective ends of fibers 304 of the fiber array held in block 302would be coupled.

Similarly to what has been described in relation with FIG. 2, at thestep illustrated in FIG. 4, the etching of the cavity is stopped at anintermediate level between the lower level of the metal level closest tocouplers 40, here metal level M1, and the upper level of layer 36 havingcouplers 40 defined therein. Preferably, this intermediate level isabove the upper level of layer 34B covering layer 10. In the example ofFIG. 4, the etching is stopped in the layer 28B having metal level M1arranged therein.

The lateral dimensions of cavity 200 and/or the location of cavity 200are determined similarly to what has been described in relation withFIG. 2, with the difference that the couplers considered herein arecouplers 40 rather than couplers 18.

At a next step, not illustrated, similarly to what has been described inrelation with FIG. 3, glue 300 is arranged in cavity 200 and block 302for holding the fibers 304 of the array is then inserted into cavity200. It will be within the abilities of those skilled in the art toadapt what has been described in relation with FIG. 3 for couplers 18and waveguides 16 to the case of FIG. 4 for couplers 40 and waveguides36.

Further, all the advantages indicated hereabove in relation with FIGS. 2and 3 can be found in this alternative embodiment by consideringcouplers 40, waveguides 36, and layer 38 rather than, respectively,couplers 18, waveguides 16, and layer 10.

FIG. 5 schematically includes FIG. 5A and 5B, which illustrate analternative embodiment of the method described in relation with FIGS. 2and 3. FIGS. 5A and 5B corresponding to the respective views of FIGS. 3Aand 3B.

In this alternative embodiment, it is provided for chip 1000 tocomprise, on the upper surface of interconnection structure 24, a guardring 500 surrounding cavity 200. The guard ring protrudes from the uppersurface of interconnection structure 24. As shown in FIG. 5, the guardring is configured to decrease, or even to prevent, a flow of glue 300beyond guard ring 500 when block 302 is inserted into cavity 200.

In this example, guard ring 500 is formed of a plurality of metalmicropillars 502 distributed on the circumference of guard ring 500,micropillars 502 extending heightwise along a direction orthogonal tothe upper surface of interconnection structure 24. In other words,micropillars 502 are arranged one after the others along thecircumference of a ring. Preferably, a same pitch or, in other words, asame distance, separates two successive micropillars 502. Preferably,the pitch is determined by the viscosity of the glue 300 used, so thatthe flow of glue 300 on the upper surface of interconnection structure24 is decreased, or even prevented, when glue 300 reaches guard ring500.

Micropillars 502 are preferably identical to micropillars (not shown) ofelectric connection of chip 1000 to another integrated circuit chip, aninterposer, or a printed circuit. As an example, each micropillar 502rests on top of and in contact with a pad 32 arranged at the level ofthe upper surface of interconnection structure 24. Preferably, pad 32 isthen electrically connected to no component of chip 1000 by vias 30 andmetal levels M1, M2, M3, and M4 of interconnection structure 24.

As an example of size, each micropillar 502 has a height in the order of10 μm, for example, of 10 μm, for a diameter in the order of 20 μm, thespace between two neighboring micropillars 502 being then for example inthe order of 20 μm.

As compared with the case where block 302 would have been directly gluedto the upper surface of interconnection structure 24 and where such aguard ring 500 would have been provided, such a guard ring would havebeen larger than in the case of FIG. 5 or, in other words, would havebeen arranged at a distance from block 302 greater than in the case ofFIG. 5. This thus enables to bring the electric connection elements, forexample, other micropillars, metal balls, pads 32, etc. closer to block302 with respect to the case where block 302 would have been directlyglued to the upper surface of interconnection structure 24.

Such an alternative embodiment and the advantages thereof apply to thealternative embodiment described in relation with FIG. 4.

In the embodiments and variations described hereabove in relation withFIGS. 1 to 5, no via 30 and no portion of metal layers 26 is provided atthe location of cavity 200 or, in other words, above couplers 18,respectively 40. However, this is already true in known chips of thetype shown in FIG. 1 which are deprived of cavities 200 and for whichblock 302 is intend to be directly glued on the upper surface ofinterconnection structure 24. Indeed, in such known chips, the presentof a via 30 or of a portion of metal layer 26 would disturb or evenprevent the propagation of an optical signal between a fiber 304 and acorresponding coupler 18 or 40. Thus, the embodiments and variationsdescribed in relation with FIGS. 2, 3, 4, and 5 are compatible withknown photonic chips.

Further, although advantages of the embodiments and variations describedhereabove have been indicated in relation with the assembly of chip 1000and of block 302 for holding the fibers 304 of the fiber array, suchadvantages are intrinsically present in chip 1000 provided with cavity200 or, in other words, result from the provision of cavity 200 in chip1000.

Various embodiments and variations have been described. It will beunderstood by those skilled in the art that certain features of thesevarious embodiments and variations may be combined, and other variationswill occur to those skilled in the art.

Finally, the practical implementation of the described embodiments andvariations is within the abilities of those skilled in the art based onthe functional indications given hereabove.

Such alterations, modifications, and improvements are intended to bepart of this disclosure, and are intended to be within the spirit andthe scope of the present invention. Accordingly, the foregoingdescription is by way of example only and is not intended to belimiting. The present invention is limited only as defined in thefollowing claims and the equivalents thereto.

What is claimed is:
 1. A method, comprising: forming a plurality ofvertical grating couplers in a first layer of a semiconductor assembly,the first layer comprising a semiconductor layer or an insulating layer;overlying a plurality of second insulating layers over the plurality ofvertical grating couplers; forming an interconnection structurecomprising a plurality of metal levels and a plurality of metal viasembedded in the second insulating layers; forming one or more phasemodulators in the first layer, each phase modulator coupled to arespective metal via; and etching a cavity extending in depth throughthe second insulating layers all the way to an intermediate levelbetween the plurality of vertical grating couplers and the metal levelclosest to the plurality of vertical grating couplers, the cavity havinglateral dimensions such that the cavity is capable of receiving a blockfor holding an array of optical fibers intended to be optically coupledto the plurality of vertical grating couplers.
 2. The method of claim 1,wherein the lateral dimensions of the cavity are equal to lateraldimensions of the block plus a tolerance margin.
 3. The method of claim2, wherein the tolerance margin is between 10 μm and 200 μm.
 4. Themethod of claim 2, wherein the tolerance margin is between 50 μm and 150μm.
 5. The method of claim 1, wherein the first layer is a semiconductorlayer of a semiconductor on insulator (SOI) device.
 6. The method ofclaim 1, wherein the first layer is an insulating layer made of siliconnitride.
 7. The method of claim 6, wherein the first layer is disposedon a semiconductor layer of a semiconductor on insulator device, andwherein the cavity has a bottom opposite the plurality of verticalgrating couplers.
 8. The method of claim 1, further comprising a guardring on an upper surface of the interconnection structure surroundingthe cavity, wherein the guard ring is formed of a plurality of metalmicropillars regularly distributed along the circumference of the guardring.
 9. A method, comprising: forming a first insulating layer; forminga plurality of vertical grating couplers in the first insulating layer;overlying a plurality of second insulating layers over the plurality ofvertical grating couplers; forming an interconnection structurecomprising a plurality of metal levels and a plurality of metal viasembedded in the second insulating layers; forming one or more phasemodulators in the first insulating layer, each phase modulator coupledto a respective metal via; and etching a cavity extending in depththrough the second insulating layers through an intermediate levelbetween the plurality of vertical grating couplers and a respectivemetal level closest to the plurality of vertical grating couplers. 10.The method of claim 9, wherein the cavity comprises lateral dimensionssuch that the cavity is capable of receiving a block for holding anarray of optical fibers intended to be optically coupled to theplurality of vertical grating couplers. ii. The method of claim 10,wherein the lateral dimensions of the cavity are equal to lateraldimensions of the block plus a tolerance margin, and wherein the cavityhas a bottom opposite the plurality of vertical grating couplers. 12.The method of claim 9, wherein the first insulating layer is disposed ona semiconductor layer of a semiconductor on insulator device.
 13. Themethod of claim 9, further comprising a guard ring on an upper surfaceof the interconnection structure surrounding the cavity, wherein theguard ring is formed of a plurality of metal micropillars regularlydistributed along the circumference of the guard ring.
 14. A methodimplemented from a semiconductor wafer comprising a plurality ofphotonic integrated circuit chips that each comprise a plurality ofvertical grating couplers defined in a first layer that underlies aninterconnection structure comprising a plurality of metal levelsembedded in insulating layers, the method comprising: etching, from anupper surface of the interconnection structure, a cavity penetratinginto the insulating layers down to an intermediate level between thecouplers and the metal level closest to the couplers, the cavity havinglateral dimensions such that the cavity is capable of receiving a blockfor holding an array of optical fibers intended to be optically coupledto the couplers.
 15. The method of claim 14, further comprisingsingulating wafer into a plurality of separate chips.
 16. The method ofclaim 14, further comprising: arranging glue in the chip cavity of oneof the chips; inserting and positioning the block in the cavity tooptically couple ends of the fibers to the couplers of the one of thechips; and hardening the glue.
 17. The method of claim 16, wherein theglue comprises epoxy.
 18. The method of claim 16, wherein hardening theglue comprises hardening the glue by polymerization caused by anexposure to a light radiation.
 19. The method of claim 18, wherein thelight radiation comprises ultraviolet light radiation.
 20. The method ofclaim 16, wherein the one of the chips further comprises a guard ring onan upper surface of the interconnection structure surrounding the cavityand wherein arranging the glue comprises using the guard ring to avoidflow of the glue beyond the guard ring.